Item

CP12 prober

Dimension

1620mm(W) *1230（D）*1450mm(H)

Wafer

200mm,300mm

Wafer thickness

250~2000μm

Die Size

350μm ~76,000μm

Transfer mode

Vacuum suction, dual arms

Accuracy

XY：±1.5μm；Z：±2.5μm

XY platform

Probing area ± 170mm, repeated positioning accuracy ± 1μm

Z axis

Repeated positioning accuracy ± 1.5μm, max speed 30mm/s

Force

50kg (optional 200kg)

Calibration

Image calibration, with high/low–power template

Index time

240ms (based on die size 6mm,Z clearance 0.5mm)

Test temperature

Ambient~150℃±1℃

Communication interface

GPIB, reserved TTL and RS232

Option

ID reading, auto card exchange